Stainless steel strip innovation on mobile phone heat dissipation: 

hot plate technology ushered in a new breakthrough

The continuous improvement of the performance of smart phones has put forward higher requirements for heat dissipation technology. Traditional heat dissipation materials have been difficult to meet the heat dissipation needs of high-power chips in the 5G era, and the innovation of heat dissipation technology is imperative. As a new type of heat dissipation material, stainless steel strip is bringing breakthrough in the field of mobile phone heat dissipation.

Stainless steel strip has excellent thermal conductivity and mechanical strength, and its thermal conductivity can reach 16-20 W/(m·K), which is 2-3 times that of traditional aluminum alloy materials. At the same time, stainless steel strip has good processing properties, can be made into ultra-thin profiles, the thickness can be controlled below 0.1mm, to meet the design requirements of thin mobile phones. In terms of corrosion resistance, stainless steel strips are outstanding and can effectively resist moisture erosion in the environment where mobile phones are used.

In mobile phone cooling applications, stainless steel strips are mainly used to manufacture core components of soaking plates. Through precision machining technology, stainless steel strip can be made into a soaking plate substrate with micro-channel structure, combined with special surface treatment process, significantly improve the heat dissipation efficiency. Test data show that the heat dissipation performance of the soaking plate using stainless steel strip is more than 40% higher than that of the traditional material, and the chip temperature can be effectively controlled below 85 ° C.

Stainless steel strip has a broad application prospect in the field of mobile phone heat dissipation. With the popularization of 5G technology and the continuous improvement of mobile phone performance, the demand for heat dissipation will continue to increase. With its excellent comprehensive performance, stainless steel strip is expected to become the first choice for the next generation 

of mobile phone cooling materials. In the future, through material formulation optimization and processing process improvement, the performance of stainless steel strips will be further improved, bringing more possibilities for mobile phone cooling technology.

The application of stainless steel strip marks a new stage of mobile phone cooling technology. The innovative application of this material not only solves the current heat dissipation problem of mobile phones, but also provides a new technical route for the heat dissipation design of high-performance mobile devices in the future. With the continuous progress of material technology, the heat dissipation performance of mobile phones will be further improved, bringing better use experience to users.